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ECCOBOND EN 3810T ECCOBOND EN 3838T
LOCTITE ECCOBOND EN 3810T and LOCTITE?
ECCOBOND EN 3838T are primarily designed for
encapsulating components on a printed circuit
board (PCB). When cured, these materials provide
stable electronic performance in temperature/
humidity/bias testing. Both materials are designed
to be jet dispensible, and their thixotropic nature
allows for improved flow control and targeted
LOCTITE ECCOBOND UF 3811 is a reworkable epoxy
underfill designed for Chip-Scale Package (CSP) and
Ball Grid Array (BGA) applications. This low-viscosity
material is formulated to flow at room temperature
with no additional preheating required