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対象电路板尺寸(L × W)
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48mm×48mm～534mm×510mm（双搬运轨道规格）
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48mm×48mm～534mm×610mm（単搬运轨道规格）
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※双搬运轨道(Ｗ)时大280 mm, 超过280mm时変为単搬运轨道搬运。
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元件种类
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MAX45种类（8mm料帯换算）
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电路板加载时间
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贴装精度/涂敷位置精度
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H24G
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±0.025mm(标准模式)/±0.038mm(生产优先模式) (3σ) cpk≧1.00
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V12/H12HS
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±0.038(±0.050) mm (3σ) cpk≧1.00
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H08M/H04S/H04SF
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±0.040mm (3σ) cpk≧1.00
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H08/H04/OF
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±0.050mm (3σ) cpk≧1.00
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H02/H01/G04
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±0.030mm (3σ) cpk≧1.00
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H02F/G04F
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±0.025mm (3σ) cpk≧1.00
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GL
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±0.100mm (3σ) cpk≧1.00
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产能
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H24G
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37,500(生产优先模式)/35,000(标准模式) cph
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V12
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26,000 cph
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H12HS
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24,500 cph
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H08M
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13,000 cph
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H08
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11,500 cph
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H04
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6,500 cph
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H04S
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9,500 cph
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H04SF
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10,500 cph
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H02
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5,500 cph
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H02F
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6,700cph
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H01
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4,200 cph
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G04
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7,500 cph
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G04F
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7,500 cph
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OF
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3,000 cph
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GL
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16,363 dph（0.22sec/dot）
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对象元件
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H24G:0201-5mm×5mm,高度：大2.0mm
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V12/H12HS:0402-7.5mm×7.5mm,高度：大3.0mm
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H08M:0603-45mm×45mm,高度：大13.0mm
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H08:0402-12mm×12mm,高度：大6.5mm
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H04:1608-38mm×38mm,高度：大9.5mm
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H04S/G04SF:1608-38mm×38mm,高度：大6.50mm
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H02/H02F/H01/0F:1608-74mm×74mm,高度：25.4mm
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G04/G04F:0402-15mm×15mm,高度：大6.5mm
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模组宽度
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1500高*2100宽*645长mm
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